Broadcom BCM2044S蓝牙手机方案

        Broadcom公司的BCM2044S具有非常低的功耗,是单片Bluetooth 2.0 + EDR手机解决方案.

        它在集成的ROM实现了降低SmartAudio噪音和回声的算法,从而不需要外接闪存,大大降低了BOM.八五计划44S手发器子系统提供具有优异接收灵敏度的高度无线电收发器,使得链接范围更宽,提供更可靠的链接性能.可用于和蜂窝手机连接的单声道手机以及和PC机连接的VoIP手机.本文介绍了BCM2044S的主要性能,方框图以及蓝牙手机应用方框图.

Broadcom Announces Worlds First Bluetooth® Headset Solution with Noise Cancellation
The Broadcom BCM2044S is a monolithic 0.13um, single-chip Bluetooth 2.0 + EDR mono headset solution with very low power consumption. This is the first headset IC in the world that implements SmartAudio noise and echo reduction algorithms in an integrated ROM, without the need of an external flash on the BOM; hence significantly reducing the BOM. This ROM solution has been designed to permit the lowest possible BOM for high- and mid-range mono headsets. The ROM contains a default application built on top of the highly interoperable Broadcom BTE-Audio Stack. Sophisticated configurability has been built into the default application allowing customers to differentiate. A small patch RAM space is also provided for last minute code changes prior to production.

The BCM2044S transceiver subsystem delivers a highly integrated radio with superior receiver sensitivity. The performance of this subsystem enables greater range and more robust link performance.
The BCM2044S power management subsystem offers the highest level of integration. This subsystem includes the switching regulator, battery charger, LED drivers, and simple battery monitor. The BCM2044S also employs multiple internal LDO regulators for improving isolation, thereby maintaining high radio performance and excellent audio quality.

The audio interface subsystem integrates a very high performance audio codec operating at 8 kHz or 16 kHz resulting in superior speech quality. The BCM2044S is packaged in 6 mm x 6 mm fine pitch BGA plastic package permitting either ultra-low cost 2-layer PCB implementations or ultra-small footprint implementations. The BCM2044S is pin for pin compatible with BCM2044 to allow single PCB design to be used across multiple tiers of headsets, reducing customer time to market and maximizing design and production investments.

主要特性:

Single-chip Bluetooth® 2.0 + EDR solution in 0.13  CMOS
High-performance ARM7TDMI® processor
On-chip ROM containing complete headset application and protocol stack based on the Broadcom® BTE-Audio Stack
Integrated SmartAudio™ 100 speech enhancement algorithms
Noise suppression
Echo suppression
Automatic volume control
Integrated switching regulator
Integrated battery charger
Integrated high-quality mono codec
Low-power operation
6 mm x 6 mm plastic FBGA RoHS lead-free package
Pin-compatible with BCM2044
Rich application configuration capability permitting differentiation
应用:
Mono headset connected to cellular phone
VoIP headset connected to PC

图1.BCM2044S方框图.

                                                图2.蓝牙手机应用方框图.


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本文来源：Broadcom公司    作者：Broadcom公司

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