NEC 3G手机解决方案

       手机是移动通信的主要工具，发展速度极快。2000年以来，由于市场渗透率很高，尚未拥有手机的消费者数量有限，手机发展速度开始减缓。目前，手机市场的主要消费者是那些换机用户。

　　预计第三代手机将受到消费者的热烈欢迎，并进一步刺激换机需求。全球各地的电信公司正在准备部署3G移动通信网络。

　　第三代手机具有新一代业务功能，它们可利用2GHz的高频波段所具备的高传输效率，提供带宽达到2Mbps的高速通信服务。这种带宽可以满足多媒体通信（譬如动画传送）的需要，一个典型的例子就是在手机上观看电视。这将彻底改变手机的应用方式。

　　为了实现3G商用，手机必须经过一系列技术改进。这些挑战包括在保持高速通信、高性能信号处理和提供很高的内存容量（用于多媒体处理）的同时，降低终端的功耗。作为半导体厂商，我们需要迎接这些挑战，提供最佳的解决方案。

　　3rd generation mobile phone

　　Mobile phone (mobile communication) use has undergone the changes shown below.

　　1st generation mobile phone (1G):

　　Used mainly as a car phone service and was provided using analog technology.

　　2nd generation mobile phone (2G):

　　Used digital technology (GSM, PDC, TDMA). Other services such as the i-mode in Japan, GPRS in Europe, service followed, and were referred to as 2.5 generation (2.5G).

　　3rd generation mobile phone (3G):

　　Uses high-speed communication and the highly efficient W-CDMA technology. The first 3G service in Japan was NTT DoCoMos FOMA, which started in October 2001. The current transmission speed is 348 kilobits/second and its ultimate goal is 2 megabits/second.

　　

　　High-end mobile terminals have performance capabilities equivalent to 10-year-old PCs. They require high-speed signal processing, advanced image processing, and high-density memory mounting technology. To meet these demanding requirements, NEC Electronics will use the following three approaches.

　　

　　1)NEC Electronics supplies two types of CPU: one for performing communication processing (digital base band) and another for processing sophisticated applications such as GPS and sound sources for termination sound, with striking improvements in quality.

　　

　　2)In 3rd generation mobile phones, LCD (liquid crystal display) components are shrinking rapidly, and more multi-paneled products are expected to appear. NEC Electronics is therefore offering LCD driver/controllers for the smooth operation of color TFT and large panels.

　　

　　3)In order to perform the processing described above, a number of high capacity memory types are required. At the same time, only a limited amount of space is available inside the mobile phone and the physical memory size must be kept as small as possible. To satisfy these contradictory requirements, high-density memory and custom IC mounting are used. A package solution will be provided that places everything into a single package using system in package (SIP) technology.

　　NEC Electronics will also provide various devices types that can be used with conventional 2nd generation mobile terminals. Please see the following block diagram.

　　

　　

　　•Up to 64 sounds could be simultaneously produced with built-in surround function.

　　(PRESS)NEC Electronics Announces New Sound Synthesizer LSI Solution for Cell Phones,Sep.15,2003

　　(PRESS)NEC Electronics Unveils Industrys Smallest and Thinnest Leadless Packages for Small Signal Discrete Devices

　　•Supported both Autonomous method and MS method and realized a compact and energy saving type.

　　(PRESS)NEC Electronics Develops GPS Chipset for Mobile Applications with Three-mode Positioning System,Jul.4,2003

　　•Reduced blinking on crystal liquid display screen and improved gradation display.

　　(PRESS)NEC Electronics Acquires Licenses for LCD Driver Patents from Honeywell,Apr.8,2003

　　•Promoted dissemination of interfaces developed by NEC Electronics.

　　(PRESS)MediaQ Supports NEC Electronics Low-power, High-speed Mobile Display Interface,Feb.03,2003

　　

　　Digital baseband

　　Cell base IC

　　CB-130 Series

　　Purchasing or developing the base-band section LSI requires prior licensing agreement between licenser and you, a customer. Contact with our sales staffs in our company for detailed information.

　　Applications

　　GPS:µPD77533, µPD77538

　　Ringer tone(tone source): µPD9990

　　Camera (MPEG4 dynamic image processing):Being developed

　　Memory

　　Low-power SRAM

　　µPD448012

　　µPD444012A

　　µPD442000A,442012A,442002

　　µPD431000A,441000L

　　µPD43256B,43257B

　　Mobile Specified RAM

　　µPD46128312

　　µPD4664312

　　µPD4632312A

　　µPD4616112

　　Flash memory

　　µPD29F064115

　　µPD29F032202AL,29F032203AL,29F032204AL

　　LCD driver

　　TFT source driver IC (w/o built-in RAM)

　　µPD161600

　　µPD161602A

　　TFT source driver IC (with built-in RAM)

　　µPD161620

　　µPD161621A

　　µPD161622

　　µPD161623

　　TFT source driver IC

　　µPD161640

　　µPD161641

　　µPD161643

　　µPD161644

　　TFT power IC

　　µPD161660

　　µPD161661

　　ackage

　　MCP/SiP development status in our company (or in NEC Electronics)

　　LCD driver

　　ource driver IC (w/o built-in RAM)

　　µPD161600

　　µPD161602A

　　TFT source driver IC (with built-in RAM)

　　µPD161620

　　µPD161621A

　　µPD161622

　　µPD161623

　　TFT gate driver IC

　　µPD161640

　　µPD161641

　　µPD161643

　　µPD161644

　　TFT power IC

　　µPD161660

　　µPD161661

 

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