Altera低功耗Cyclone III FPGA实现便携式应用的高度集成

       2008年3月27日，Altera公司(NASDAQ: ALTR)宣布，65-nm Cyclone® III FPGA系列推出新的8x8 mm2封装(M164)，为设计人员提供单位电路板上容量最大的FPGA。设计人员现在可以充分利用Cyclone III器件的低功耗和大容量领先优势，设计实现消费类、军事和工业市场上空间受限的大批量应用。

       MicroE系统公司电气系统工程总监Paul Remillard评论说：“我们的客户非常看重小型、快速、智能和低成本Mercury编码器解决方案。我们之所以选择Cyclone III FPGA，是因为其超小型8x8 mm2封装具有很强的功能和很好的性能。而且，低功耗、低散热Cyclone III FPGA使我们更容易将FPGA集成到新产品的小外形封装中。”

       新的8x8 mm2 164引脚封装具有高达16K的逻辑单元(LE)，扩展了Cyclone III FPGA的大容量小封装产品，该系列包括14x14 mm2 256引脚(U256)和17x17 mm2 484引脚(U484)封装。每一封装在其布局下都有丰富的逻辑和I/O，支持工程师在新的应用中使用FPGA，例如，手持式无线电设备、卫星电话、I/O模块和消费类显示器等应用。

       Cyclone III器件功耗比竞争FPGA低75％，具有5K至120K LE，以及4 Mbits的存储器和288个数字信号处理(DSP)乘法器。而且，Cyclone III FPGA系列比竞争低成本FPGA性能高出近60％。Cyclone III系列采用了TSMC的65-nm低功耗(LP)工艺，提供商业、工业和扩展温度范围支持。

       Altera公司低成本产品营销总监Luanne Schirrmeister说：“很多大批量应用设计人员都需要功耗最低、占用电路板面积最小的高性能解决方案。我们为空间受限应用的设计人员提供完整的小封装产品组合，使他们能够使用市场上最高级的大批量、低功耗FPGA。”

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      Altera’s Low-Power Cyclone III FPGAs Deliver Highest Integration for Portable Applications

New M164 Package Features Highest Logic, Memory and DSP per Board Area in Power- and Space-Sensitive Applications

      Hong Kong, March 27, 2008—Providing designers with the highest density FPGA per board area, Altera Corporation (NASDAQ: ALTR) today announced the availability of new 8x8 mm2 packaging (M164) for its family of 65-nm Cyclone® III FPGAs. Designers of space-constrained high-volume applications in consumer, military and industrial markets can now take advantage of the combined lowest power and density leadership of the Cyclone III devices.

      “Our customers value small, fast, smart, and low-cost solutions in our Mercury Encoders,” said Paul Remillard, director, electronic systems engineering, MicroE Systems. “We chose Cyclone III FPGAs because of the high functionality and performance that is provided in the ultra-small 8x8 mm2 package. Furthermore, the low-power, low-heat dissipation of Cyclone III FPGAs makes it easier for us to integrate FPGAs into our new product’s small form factors.”

      The new 8x8 mm2 164-pin package with up to 16K logic elements (LEs) extends the Cyclone III FPGA’s high-density small-package offering that includes 14x14 mm2 256-pin (U256) and 17x17 mm2 484-pin (U484) packages. Each of these packages offers the highest amount of logic and I/Os for its footprint, allowing engineers to use FPGAs in new applications, such as handheld radios, satellite phones, I/O modules, and consumer displays.

      Cyclone III devices consume 75 percent less power than competing FPGAs while delivering 5K to 120K LEs, up to 4 Mbits of memory and up to 288 digital signal processing (DSP) multipliers. Further, the Cyclone III FPGA family delivers as much as 60 percent faster performance than competing low-cost FPGAs. Built on TSMC’s 65-nm Low-Power (LP) process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.

      “Many designers of high-volume applications need a solution that provides maximum functionality with the lowest power while using minimal board space,” said Luanne Schirrmeister, director of marketing, low-cost products, Altera Corporation. “Our complete lineup of small packages allows designers with demanding space constraints to use the most advanced high-volume, low-power FPGA in the market.”

      For more information about Cyclone III FPGAs, including white papers, handbooks and webcasts, visit www.altera.com/cyclone3.